Additive printed circuit boards and method of manufacture
US3959523A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1973 |
| Grant date | May 25, 1976 |
| Priority date | — |
| Expiry date | Dec 14, 1993 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0344
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.