John Grunwald
29Patents
12h-index
17Co-inventors
78Inventor score
Filing activity: Dec 14, 1973 → Oct 5, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4265943A | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions | Chemistry; Metallurgy | 278 | Expired |
| US5641608A | Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6875097B2 | Fixed abrasive CMP pad with built-in additives | Performing Operations; Transporting | 50 | Expired |
| US4608275A | Oxidizing accelerator | Chemistry; Metallurgy | 31 | Expired |
| US4209331A | Electroless copper composition solution using a hypophosphite reducing agent | Chemistry; Metallurgy | 29 | Expired |
| US4279948A | Electroless copper deposition solution using a hypophosphite reducing agent | Chemistry; Metallurgy | 28 | Expired |
| US4110147A | Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5895581A | Laser imaging of printed circuit patterns without using phototools | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4800132A | Mechanical plating with oxidation-prone metals | Emerging Cross-Sectional Technologies | 17 | Expired |
| US3978252A | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon | Emerging Cross-Sectional Technologies | 17 | Expired |
| US3959523A | Additive printed circuit boards and method of manufacture | Electricity | 16 | Expired |
| US4701390A | Thermally stabilized photoresist images | Physics | 15 | Expired |
| US5342734A | Deep UV sensitive photoresist resistant to latent image decay | Physics | 10 | Expired |
| US4100312A | Method of making metal-plastic laminates | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5620612A | Method for the manufacture of printed circuit boards | Electricity | 7 | Expired |
| US4762768A | Thermally stabilized photoresist images | Physics | 6 | Expired |
| US5290608A | Method for forming a patterned mask | Electricity | 5 | Expired |
| US4950504A | Mechanical plating with oxidation-prone metals | Chemistry; Metallurgy | 4 | Expired |
| US6896710B2 | Abrasives for CMP applications | Electricity | 4 | Expired |
| US6599563B2 | Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals | Chemistry; Metallurgy | 2 | Expired |
| US4775601A | Mechanical galvanizing coating resistant to chipping, flaking and cracking | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7247557B2 | Method and composition to minimize dishing | Electricity | 1 | Expired |
| US6524490B1 | Method for electroless copper deposition using a hypophosphite reducing agent | Electricity | 1 | Expired |
| US6805911B2 | Method and apparatus for improving interfacial chemical reactions | Electricity | 0 | Expired |
| US6955586B2 | CMP composition and process | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.