Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US3978252A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1975 |
| Grant date | Aug 31, 1976 |
| Priority date | — |
| Expiry date | Feb 24, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.