Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
US4110147A · kind A · utility
23Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 1977 |
| Grant date | Aug 29, 1978 |
| Priority date | — |
| Expiry date | Jan 3, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is disclosed comprising laminating an anodically treated aluminum surface against a thermoset plastic substrate, whereby the surface of the substrate after chemically removing the aluminum has an improved affinity for the adherence thereon of electrolessly deposited metal films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.