Exposure process
US4267259A · kind A · utility
3Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1979 |
| Grant date | May 12, 1981 |
| Priority date | — |
| Expiry date | Feb 16, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/168
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Radiation sensitive layers are x-ray exposed by providing a metal mask pattern on the layer through which the layer is exposed. The metal mask pattern is formed by applying a blanket metal layer to the radiation sensitive layer followed by an electron beam sensitive resist layer which is patterned by an electron beam exposure process. The exposed portions of the metal layer are then etched away to form the metal mask pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.