Bath and process for plating lead and lead/tin alloys
US4565610A · kind A · utility
31Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1985 |
| Grant date | Jan 21, 1986 |
| Priority date | — |
| Expiry date | Apr 15, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.