David N. Schram
9Patents
9h-index
2Co-inventors
51Inventor score
Filing activity: Dec 22, 1983 → Sep 20, 1990
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4565609A | Bath and process for plating tin, lead and tin-lead alloys | Electricity | 38 | Expired |
| US4871429A | Limiting tin sludge formation in tin or tin/lead electroplating solutions | Electricity | 35 | Expired |
| US4565610A | Bath and process for plating lead and lead/tin alloys | Electricity | 31 | Expired |
| US4617097A | Process and electrolyte for electroplating tin, lead or tin-lead alloys | Electricity | 25 | Expired |
| US4717460A | Tin lead electroplating solutions | Electricity | 20 | Expired |
| US4599149A | Process for electroplating tin, lead and tin-lead alloys and baths therefor | Electricity | 19 | Expired |
| US4640746A | Bath and process for plating tin/lead alloys on composite substrates | Electricity | 16 | Expired |
| US4681670A | Bath and process for plating tin-lead alloys | Electricity | 16 | Expired |
| US5094726A | Limiting tin sludge formation in tin or tin-lead electroplating solutions | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.