Additive processing electroless metal plating using aqueous photoresist
US4574031A · kind A · utility
20Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1985 |
| Grant date | Mar 4, 1986 |
| Priority date | — |
| Expiry date | Mar 29, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for making a printed circuit board employing an aqueous type photoresist and including etching of the substrate surface with chromic acid after application of the photoresist mask, chromium is washed from the surface with a reducing agent at a pH of .ltoreq.10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.