Process for electroplating tin, lead and tin-lead alloys and baths therefor
US4599149A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1983 |
| Grant date | Jul 8, 1986 |
| Priority date | — |
| Expiry date | Dec 22, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90.degree. F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.