Process and electrolyte for electroplating tin, lead or tin-lead alloys
US4617097A · kind A · utility
25Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1985 |
| Grant date | Oct 14, 1986 |
| Priority date | — |
| Expiry date | Sep 20, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90.degree. F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.