Apparatus for coating materials by cathode sputtering
US4622121A · kind A · utility
76Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1985 |
| Grant date | Nov 11, 1986 |
| Priority date | — |
| Expiry date | Apr 18, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Arrangements for coating substrates, comprising a hollow cathode around the substrate with at least two sputtering zones with the proportion between the sputtering performances in the zone being adjustable, to obtain a more uniform coating also of lateral surfaces formed by steps on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.