Bath and process for plating tin/lead alloys on composite substrates
US4640746A · kind A · utility
16Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1985 |
| Grant date | Feb 3, 1987 |
| Priority date | — |
| Expiry date | Sep 11, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating bath and process for electroplating composite substrates having an electroplatable metallic portion and a non-conductive inorganic portion with a tin-lead alloy which will plate only on the metallic portions of the substrate and not plate on or otherwise adversely affect the non-conductive inorganic portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.