Bath and process for plating tin-lead alloys
US4681670A · kind A · utility
16Cited by
14References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1986 |
| Grant date | Jul 21, 1987 |
| Priority date | — |
| Expiry date | Sep 4, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating bath and process for electroplating substrates with a tin-lead alloy from an electrolyte containing a soluble tin compound, a soluble lead compound and a complexing agent in an amount sufficient to maintain the metals in solution. Th electrolyte has a pH range of about 1.5 to 5.5 and is free from substantial amounts of free acid or free base components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.