Photolithographic etching process using organosilicon polymer composition
US4693960A · kind A · utility
10Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1986 |
| Grant date | Sep 15, 1987 |
| Priority date | — |
| Expiry date | Nov 7, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/119
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition containing a polysiloxane having a polymerizable ethylenically unsaturated group, and 2,2-dimethoxy-2-phenyl acetophenone as an ultraviolet light sensitizer; and use thereof in lithography.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.