Jane M. Shaw
83Patents
25h-index
112Co-inventors
91Inventor score
Filing activity: Feb 24, 1978 → Nov 7, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6184121A | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Electricity | 281 | Expired |
| US5470661A | Diamond-like carbon films from a hydrocarbon helium plasma | Emerging Cross-Sectional Technologies | 265 | Expired |
| US4975079A | Connector assembly for chip testing | Electricity | 212 | Expired |
| US6929900B2 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Electricity | 118 | Expired |
| US5582858A | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Emerging Cross-Sectional Technologies | 109 | Expired |
| US5198153A | Electrically conductive polymeric | Emerging Cross-Sectional Technologies | 94 | Expired |
| US6686539B2 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Electricity | 89 | Expired |
| US5536921A | System for applying microware energy in processing sheet like materials | Electricity | 82 | Expired |
| US4212935A | Method of modifying the development profile of photoresists | Physics | 81 | Expired |
| US5258236A | Multi-layer thin film structure and parallel processing method for fabricating same | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5569501A | Diamond-like carbon films from a hydrocarbon helium plasma | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5534094A | Method for fabricating multi-layer thin film structure having a separation layer | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5191182A | Tuneable apparatus for microwave processing | Emerging Cross-Sectional Technologies | 50 | Expired |
| US6097019A | Radiation control system | Electricity | 41 | Expired |
| US5202061A | Electrically conductive polymeric materials and uses thereof | Electricity | 38 | Expired |
| US6577011B1 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Electricity | 38 | Expired |
| US5495397A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5200112A | Electrically conductive polymeric materials and uses thereof | Electricity | 31 | Expired |
| US5793836A | X-ray mask pellicle | Physics | 31 | Expired |
| US5700398A | Composition containing a polymer and conductive filler and use thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5817986A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5837978A | Radiation control system | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5591285A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5721299A | Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof | Electricity | 27 | Expired |
| US5397863A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 25 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.