Tin lead electroplating solutions
US4717460A · kind A · utility
20Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1987 |
| Grant date | Jan 5, 1988 |
| Priority date | — |
| Expiry date | Jun 18, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.