Wafer probe
US4764723A · kind A · utility
93Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 1986 |
| Grant date | Aug 16, 1988 |
| Priority date | — |
| Expiry date | Nov 10, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.