Single point bonding method and apparatus
US4776509A · kind A · utility
57Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1987 |
| Grant date | Oct 11, 1988 |
| Priority date | — |
| Expiry date | May 19, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.