Blanket tungsten deposition for dielectric
US4777061A · kind A · utility
22Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1987 |
| Grant date | Oct 11, 1988 |
| Priority date | — |
| Expiry date | Dec 14, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is disclosed for depositing tungsten non-selectively on conductors and dielectrics without the use of an adhesive interlayer. The process comprises an argon pre-treatment followed by low power plasma deposition to nucleate the tungsten. A thick, adherent layer of tungsten is then deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.