Wafer and method of working the same
US4783225A · kind A · utility
19Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1986 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Feb 19, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/219
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epitaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.