Etuo Egashira
4Patents
3h-index
3Co-inventors
43Inventor score
Filing activity: Feb 19, 1986 → Nov 3, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4783225A | Wafer and method of working the same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5230747A | Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5279992A | Method of producing a wafer having a curved notch | Emerging Cross-Sectional Technologies | 10 | Expired |
| USRE40139E1 | Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.