Hisashi Maejima
16Patents
12h-index
20Co-inventors
78Inventor score
Filing activity: Sep 19, 1978 → Aug 30, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD623841S1 | Shoe upper | General | 90 | Expired |
| USD697299S1 | Shoe upper | General | 66 | Active |
| USD574590S1 | Shoe upper | General | 53 | Expired |
| USD659986S1 | Shoe upper | General | 49 | Expired |
| US5025284A | Exposure method and exposure apparatus | Physics | 37 | Expired |
| US4544318A | Manufacturing system | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4699505A | Exposure method and exposure apparatus | Physics | 33 | Expired |
| US5497331A | Semiconductor integrated circuit device fabrication method and its fabrication apparatus | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6174222A | Process for fabrication of semiconductor device, semiconductor wafer for use in the process and process for the preparation of the wafer | Electricity | 20 | Expired |
| US4783225A | Wafer and method of working the same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US4974018A | Exposure method and exposure apparatus | Physics | 16 | Expired |
| US4477182A | Pattern exposing apparatus | Physics | 15 | Expired |
| US5230747A | Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5279992A | Method of producing a wafer having a curved notch | Emerging Cross-Sectional Technologies | 10 | Expired |
| US4218136A | Method of and apparatus for aligning photomask | Physics | 6 | Expired |
| USRE40139E1 | Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.