Patent · US Expired

Wafer handling tool and method of use

US4823654A · kind A · utility

6Cited by
4References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 8, 1988
Grant dateApr 25, 1989
Priority date
Expiry dateFeb 8, 2008

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/53909
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

An IC-wafer handling tool comprising an aluminum handle, a detachable polyimid pointed end member and a detachable polyimid hook end member. The pointed end is used in cooperation with a vacuum pick to load wafers into susceptor pockets, and the hooked end is used in cooperation with a vacuum pick to unload wafers. During loading and unloading, the only contact with the front side of the wafer is at the edge of the wafer, which does not contain integrated circuit structure, thereby decreasing particulate contamination of the wafer and the associated IC structure on the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.