Wafer handling tool and method of use
US4823654A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1988 |
| Grant date | Apr 25, 1989 |
| Priority date | — |
| Expiry date | Feb 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53909
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An IC-wafer handling tool comprising an aluminum handle, a detachable polyimid pointed end member and a detachable polyimid hook end member. The pointed end is used in cooperation with a vacuum pick to load wafers into susceptor pockets, and the hooked end is used in cooperation with a vacuum pick to unload wafers. During loading and unloading, the only contact with the front side of the wafer is at the edge of the wafer, which does not contain integrated circuit structure, thereby decreasing particulate contamination of the wafer and the associated IC structure on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.