Wafer probe
US4827211A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1987 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Jan 30, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board form constant impedance transmission lines for connecting test equipment to the contact pads. A ground contact is mounted on the upper side of the substrate near the end on which the contact pads are mounted, the ground contact being connected by a conductive path to the ground conductors on the under side of the substrate. When two such wafer probes simultaneously access bonding pads on the same planar device, the ground conductors of the two probes are interconnected by a conductive sheet of foil extending between the ground contacts on the upper sides of the substrates of both wafer probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.