Method and apparatus for removing coating from substrate
US4836902A · kind A · utility
10Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1987 |
| Grant date | Jun 6, 1989 |
| Priority date | — |
| Expiry date | Oct 9, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31138
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, ultraviolet radiation generated as a byproduct of plasma generation is absorbed by a baffle placed between a plasma source and the substrate. The baffle inhibits incidence of ultraviolet light on the substrate while permitting flow of activated gas onto the substrate to chemically strip the photoresist from the substrate. Use of the baffle reduces microscopic damage to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.