Patent · US Expired

Process of making an electronic device package with peripheral carrier structure of low-cost plastic

US4837184A · kind A · utility

42Cited by

3References

19Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Paul T. Lin · Austin, US
Michael B. McShane · Austin, US
Charles G. Bigler · Austin, US
John A. Goertz · Red Rock, US

Key dates

Filing date	Jan 4, 1988
Grant date	Jun 6, 1989
Priority date	—
Expiry date	Jan 4, 2008

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49172
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.