Laser Bonding apparatus and method
US4845335A · kind A · utility
31Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1988 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | Jan 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.