Anodizable strain layer for SOI semiconductor structures
US4849370A · kind A · utility
16Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1987 |
| Grant date | Jul 18, 1989 |
| Priority date | — |
| Expiry date | Dec 21, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicon on insulator semiconductor structure employs a strain layer fabricated of an electrically inactive material. The strain layer comprises silicon with a germanium additive to produce a sublayer exhibiting a low breakdown voltage and thus effective for selective anodization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.