Hermetically sealed package having an electronic component and method of making
US4852250A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 19, 1988 |
| Grant date | Aug 1, 1989 |
| Priority date | — |
| Expiry date | Jan 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.