Apparatus and method for the fluid treatment of a workpiece
US4856456A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1988 |
| Grant date | Aug 15, 1989 |
| Priority date | — |
| Expiry date | Oct 3, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.