Apparatus for treating the surfaces of wafers
US4870923A · kind A · utility
93Cited by
4References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 1988 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Jun 27, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/455
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for treating the surface of wafers with a vaporous agent. The apparatus includes an arrangement in which, prior to being discharged, excess vapor stays for a while outside a treating chamber so as to keep the treating vapor and the discharging excess vapor at the same vaporous level. Thus, treating vapor evenly contacts the entire surface of a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.