Electronic components comprising polymide dielectric layers
US4871619A · kind A · utility
11Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1986 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Nov 20, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.