Mark A. Takacs
18Patents
13h-index
43Co-inventors
74Inventor score
Filing activity: Oct 3, 1984 → May 17, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6336262B1 | Process of forming a capacitor with multi-level interconnection technology | Emerging Cross-Sectional Technologies | 89 | Expired |
| US5094769A | Compliant thermally conductive compound | Electricity | 44 | Expired |
| US4599136A | Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials | Electricity | 42 | Expired |
| US6596621B1 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Electricity | 30 | Expired |
| US4665007A | Planarization process for organic filling of deep trenches | Electricity | 30 | Expired |
| US4749621A | Electronic components comprising polyimide-filled isolation structures | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4656050A | Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers | Electricity | 24 | Expired |
| US5808853A | Capacitor with multi-level interconnection technology | Emerging Cross-Sectional Technologies | 23 | Expired |
| US4654223A | Method for forming a film of dielectric material on an electric component | Electricity | 23 | Expired |
| US5135595A | Process for fabricating a low dielectric composite substrate | Electricity | 19 | Expired |
| US5139851A | Low dielectric composite substrate | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5213704A | Process for making a compliant thermally conductive compound | Chemistry; Metallurgy | 14 | Expired |
| US4568601A | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures | Emerging Cross-Sectional Technologies | 14 | Expired |
| US4699803A | Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers | Electricity | 13 | Expired |
| US4871619A | Electronic components comprising polymide dielectric layers | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5277725A | Process for fabricating a low dielectric composite substrate | Electricity | 10 | Expired |
| US4622383A | Method for the fractionation of reactive terminated polymerizable oligomers | Electricity | 2 | Expired |
| US6555912B1 | Corrosion-resistant electrode structure for integrated circuit decoupling capacitors | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.