Inventor · Fishkill, NY, US

Steven M. Kandetzke

14Patents
10h-index
33Co-inventors
64Inventor score

Filing activity: Oct 3, 1984 → May 11, 1992

Most-cited inventions

PatentTitleAreaCited byStatus
US4885038A Method of making multilayered ceramic structures having an internal distribution of copper-based conductors Electricity 72 Expired
US4599136A Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials Electricity 42 Expired
US4749621A Electronic components comprising polyimide-filled isolation structures Emerging Cross-Sectional Technologies 24 Expired
US4656050A Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers Electricity 24 Expired
US4654223A Method for forming a film of dielectric material on an electric component Electricity 23 Expired
US5135595A Process for fabricating a low dielectric composite substrate Electricity 19 Expired
US5139851A Low dielectric composite substrate Emerging Cross-Sectional Technologies 16 Expired
US4568601A Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures Emerging Cross-Sectional Technologies 14 Expired
US4699803A Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers Electricity 13 Expired
US4871619A Electronic components comprising polymide dielectric layers Emerging Cross-Sectional Technologies 11 Expired
US5277725A Process for fabricating a low dielectric composite substrate Electricity 10 Expired
US5147741A Phenyl-endcapped depolymerizable polymer Physics 7 Expired
US4987211A Phenyl-endcapped depolymerizable polymer Physics 3 Expired
US4622383A Method for the fractionation of reactive terminated polymerizable oligomers Electricity 2 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.