Metal electronic package
US4897508A · kind A · utility
77Cited by
22References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1988 |
| Grant date | Jan 30, 1990 |
| Priority date | — |
| Expiry date | Feb 10, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.