Etching method and etching apparatus
US4931135A · kind A · utility
392Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1988 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Dec 21, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A mounting surface of an electrode for mounting an object to be processed thereon is projected to be a curved surface identical to a curved surface obtained by deforming the object to be processed by a uniform load, and etching of the object to be processed is performed. Etching of the object to be processed can be easily and stably performed, thereby improving yield and productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.