Cleaning apparatus having a contact buffer apparatus
US4935981A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1989 |
| Grant date | Jun 26, 1990 |
| Priority date | — |
| Expiry date | Jan 6, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved swing type substrate cleaning apparatus comprises a substrate chuck for holding the substrate while rotating the same, a cleaning brush holding apparatus for holding a cleaning brush while rotating the same, a cleaning brush elevating apparatus for holding the cleaning brush holding apparatus in a manner enabling elevation and swing of the same, and a buffer apparatus for reducing the velocity at which the cleaning brush elevating apparatus lowers the cleaning brush holding apparatus when the cleaning brush is lowered to be in contact with the substrate. Since the velocity with which the cleaning brush is lowered is reduced to be lower than a prescribed value by means of the buffer apparatus, no significant shock is created when the cleaning brush is brought into contact with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.