Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
US4942108A · kind A · utility
9Cited by
21References
16Claims
0Family size
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Key dates
| Filing date | Sep 8, 1989 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Sep 8, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The dissolution rate in alkaline developer solutions of image-wise exposed photoresist systems based on diazoquinone sensitized polyamic acid is reduced to prepare relief images of fine line resolution by reducing the acidity of the polyamic acid prior to exposure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.