Apparatus for transporting wafer to and from polishing head
US4944119A · kind A · utility
59Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1988 |
| Grant date | Jul 31, 1990 |
| Priority date | — |
| Expiry date | Jun 20, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.