Metal packages having improved thermal dissipation
US4961106A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1987 |
| Grant date | Oct 2, 1990 |
| Priority date | — |
| Expiry date | Aug 31, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.