Direct electroplating of through holes
US4969979A · kind A · utility
56Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | May 8, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Substantially nonconductive or semiconductive surfaces of through holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.