Anodizable strain layer for SOI semiconductor structures
US4982263A · kind A · utility
16Cited by
13References
13Claims
0Family size
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Key dates
| Filing date | Mar 10, 1989 |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | Mar 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicon on insulator semiconductor structure employs a strain layer fabricated of an electrically inactive material. The strain layer comprises silicon with a germanium additive to produce a sublayer exhibiting a low breakdown voltage and thus effective for selective anodization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.