Method for erosion detection of a sputtering target and target arrangement
US4983269A · kind A · utility
30Cited by
6References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 1989 |
| Grant date | Jan 8, 1991 |
| Priority date | — |
| Expiry date | Mar 15, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device to detect erosion of a target surface of sputtering sources in cathode sputtering layouts which has a target with at least one sensor at a predetermined position which is unchanged during the cathode sputtering process, directly detects the eroding of the target at a predetermined location. As a sensor measured quantity, photometric, electrical temperature, or pressure in the process chamber is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.