Multilayered metallurgical structure for an electronic component
US4985310A · kind A · utility
23Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Sep 5, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, cooper and/or aluminum. Directly on the base metallurgy is a layer of cobalt. The structure may also include a layer of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.