Semiconductor device and method of manufacturing the same
US4987474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1990 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Jun 12, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.