High speed tin, lead or tin/lead alloy electroplating
US4994155A · kind A · utility
13Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1989 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Sep 20, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.