Robert Schetty
7Patents
6h-index
19Co-inventors
56Inventor score
Filing activity: Dec 9, 1988 → Jun 4, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6444110B1 | Electrolytic copper plating method | Electricity | 39 | Expired |
| US6860981B2 | Minimizing whisker growth in tin electrodeposits | Chemistry; Metallurgy | 19 | Expired |
| US6531046B2 | Seed layer repair method | Electricity | 17 | Expired |
| US4994155A | High speed tin, lead or tin/lead alloy electroplating | Chemistry; Metallurgy | 13 | Expired |
| US4880507A | Tin, lead or tin/lead alloy electrolytes for high speed electroplating | Chemistry; Metallurgy | 11 | Expired |
| US7270734B1 | Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating | Chemistry; Metallurgy | 10 | Expired |
| US6982030B2 | Reduction of surface oxidation during electroplating | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.