Packaged semiconductor device having a low cost ceramic PGA package
US5006922A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1990 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Feb 14, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/output pins are attached to through-holes in the base and extend through the base and are exposed by holes in the cap aligned to the through-holes in the base. Extensive glass sealing of the cap to the base, made possible by the substantially co-extensive nature of the cap with respect to the base, provides a sturdy highly reliable seal making the packaged semiconductor device better able to withstand mechanical stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.