Three-dimensional printed circuit board
US5008496A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1989 |
| Grant date | Apr 16, 1991 |
| Priority date | — |
| Expiry date | Jul 24, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.