Juergen Bednarz
3Patents
3h-index
6Co-inventors
36Inventor score
Filing activity: Jul 24, 1989 → Jan 8, 1992
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5008496A | Three-dimensional printed circuit board | Emerging Cross-Sectional Technologies | 66 | Expired |
| US5106785A | Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5376824A | Method and an encapsulation for encapsulating electrical or electronic components or assemblies | Emerging Cross-Sectional Technologies | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.